Circuit Fabology Microelectronics Equipment Co.,Ltd is a military entity of Chinese Communist Party

Circuit Fabology Microelectronics Equipment Co.,Ltd合肥芯碁微电子装备股份有限公司 Prospectus

The issuer focuses on serving customers in the PCB field and pan-semiconductor field in the electronic information industry, and helps customers realize digital, unmanned, and intelligent development while improving product quality and reducing production costs through excellent products. After years of intensive cultivation and accumulation, the issuer has served nearly 70 customers, including AVIC Shennan Circuits深南电路股份有限公司, TRIPOD TECHNOLOGY CORPORATION健鼎科技股份有限公司, Victory Giant Technology (HuiZhou) Co.,Ltd胜宏科技（惠州）股份有限公司, Shenzhen Kinwong Electronic Co., Ltd深圳市景旺电子股份有限公司, Zhejiang Leuchtek Technology Co., Ltd浙江罗奇泰克科技股份有限公司, Honghuasheng Precision Electronics (Yantai) Co., Ltd宏华胜精密电子（烟台）有限公司(joint venture or associate of Hon Hai Precision Industry Co., Ltd鸿海精密工业股份有限公司), Sihui Fuji Electronics Technology Co., Ltd四会富仕电子科技股份有限公司, Bomin Electronics Co., Ltd博敏电子股份有限公司, Jiangxi Redboard Technology Co., Ltd红板（江西）有限公司, Mutual-Tek industries Co., Ltd相互股份有限公司, PLOTECH CO., LTD柏承科技股份有限公司, TAIWAN FLEX ELECTRONICS INC台湾软电股份有限公司, SHING TECH ELECTRONICS CO., LTD迅嘉电子股份有限公司, Zhuhai Topsun Electronic Technology Co.,Ltd珠海元盛电子科技股份有限公司, Jiangsu Provision Electronics Co., Ltd江苏普诺威电子股份有限公司 and Dalian Suntak Circuit Co., Ltd大连崇达电路有限公司 (subsidiaries of Suntak Technology Co., Ltd崇达技术股份有限公司), Hefei Smat Technology Co., ltd合肥矽迈微电子科技有限公司, Kunshan Govisionox Optoelectronics Co., Ltd昆山国显光电有限公司 (subsidiary of Visionox Technology Inc维信诺科技股份有限公司), Institute of Semiconductors of Chinese Academy of Sciences中国科学院半导体研究所, Laser Fusion Research Center of China Academy of Engineering Physics中国工程物理研究院激光聚变研究中心, China Electronics Technology Group Corporation 11th Research Institute、中国电子科技集团公司第十一研究所, University of Science and Technology of China中国科学技术大学, Huazhong University of Science and Technology华中科技大学, Guangdong University of Technology广东工业大学,etc

Circuit Fabology Microelectronics Equipment Co.,Ltd is engaged in the R&D, manufacturing, sales and corresponding maintenance services of direct imaging equipment and direct writing lithography equipment with micro-nano direct writing lithography as the technology core. The main products and services include PCB direct imaging equipment and automatic line system, pan-semiconductor direct writing lithography equipment and automatic line system, other laser direct imaging equipment and after-sales maintenance services for the above products. The product functions cover multi-field lithography links from micron to nanometer.

Wintech Microelectronics Co., Ltd

graphics generator control module, USD



memory module, voltage module



USD



DMD illuminator

automatic connection RMB

Schmid Automation (Dongguan) Co., Ltd. equipment

USD



DMD integrated block



light source module JPY





ection V Basic Situation of the Issuer









I General Situation of the Issuer







Issuer



Name in English



Registered Capital RMB 90,597,552



Legal Representative Zhuo Cheng

Date of Incorporation

of Private Company 30th June 2015

Date of Change into PLC 23rd October 2019

Place of Residence 11th Floor, F3 Building, Phase II, Innovation Industrial Park, No. 2800 Innovation

Avenue, High-tech Zone, Hefei









Circuit Fabology Microelectronics Equipment Co.,Ltd Prospectus









Development of advanced mask plate making equipment





This topic is based on the existing mask plate making equipment technology, and continues to develop plate making



equipment with higher technology nodes. Through this project, it will help my country to break through the technical restrictions and



blockade of international equipment giants on my country's pan-semiconductor high-end equipment, help to ensure the information



security of national defense, military industry, aerospace and other cutting-edge fields, and promote the improvement of my country's pan-semiconductor local industry chain.

HING WONG, male, born in September 1962, American nationality, doctoral candidate in the Department of Electrical Engineering, University of California, Berkeley. From January 1990 to June 1997, HING WONG worked as a technology development engineer at IBM Corporation in the United States; from July 1997 to December 1997, he worked as an engineer at Chromatic Research Corporation in the United States;  From January 2004 to December 2004, served as a senior consultant of Silicon Federation Investment Company in the United States; from May 2005 to now, served as Managing Director of Walden Investment Consulting (Beijing) Co., Ltd. ; Since October 2019, he has served as a director of Circuit Fabology Microelectronics Equipment Co.,Ltd.

CHEN DONG, Chief Scientist, male, born in October 1960, American nationality, Ph.D. in Physics, University of Wisconsin-Madison, postdoctoral fellow, Optical Science Center, University of Arizona, USA. From July 1995 to July 2000, CHEN DONG served as a researcher at the Technology Research Center of IBM Corporation in the United States; from November 2001 to October 2010 , served as Chief Scientist of the Automatic Scanning Microscope Branch and the Optical Precision Metrology Branch of Veeco; from October 2010 to December 2015, served as the Chief Scientist of the Probe and Precision Optical Metrology Branch of the Nano Surface Group of the American Bruker Company; From January 2016 to April 2018, he served as the chief system design engineer of Science Day Corporation; from April 2018 to October 2019, he served as the chief scientist of Xinqi Co., Ltd.; from October 2019 to the present, he served as the chief scientist of the Circuit Fabology Microelectronics Equipment Co.,Ltd.